井冈山What role does diamond micro-powder play in 5G technology?

In the current era when 5G communication technology is redefining the boundaries of information transmission at a rate of 10Gbps per second, diamond micro-powder, with its super-hard properties and thermal management advantages, is becoming a key material to break through physical limits. From base station power modules to mobile phone cooling systems, from high-frequency device manufacturing to quantum communication research and development, this technological revolution led by "industrial diamonds" is reshaping the 5G industrial ecosystem.

Base station heat dissipation: The "Heat Sink Revolution" for 20℃ Cooling

The power density of 5G base stations is three times higher than that of 4G, and traditional heat dissipation materials can no longer meet the requirements. Diamond heat sink plates, with a thermal conductivity of 2000W/m·K, have become the core solution to the heat dissipation bottleneck. In the base station heat dissipation module released by Huawei in 2025, after adopting diamond heat sink plates, the operating temperature of the RF chip dropped from 85℃ to 65℃, and the equipment's lifespan was extended by 40%. Experimental data shows that diamond heat sink plates increase the power density of millimeter-wave antenna modules by 50% while reducing their volume by 30%, providing key support for the miniaturized deployment of 5G base stations.

In the field of power amplifiers, breakthroughs have been made in the integration technology of diamond and gallium nitride (GaN). Through surface activation bonding technology, the heat dissipation efficiency of diamond-based GaN-HEMT devices has been increased by three times, and the output power density has exceeded 10W/mm², which is 200% higher than that of traditional silicon-based devices. This technology has been applied to ZTE's 5G base stations, expanding the coverage radius of a single station by 15% and reducing operation and maintenance costs by 25%.

Terminal heat dissipation: The phone remains hot to the touch after continuous gaming for 3 hours

The power consumption of 5G mobile phones is 30% higher than that of 4G ones, and the heat dissipation issue has become a bottleneck restricting the user experience. Tests conducted by Xiaomi's laboratory show that the phone with a 0.5mm thick diamond heat dissipation film maintained a body temperature below 42℃ after playing Genshin Impact for three consecutive hours, which is 8℃ lower than the traditional graphene heat dissipation solution. This heat dissipation film achieves a thermal conductivity of 1200W/m·K through the combination of nano-diamond micro-powder and polymer materials, while maintaining a thin and light thickness of 0.3mm.

In the field of chip packaging, 3D chip stacking technology places higher demands on heat dissipation. The diamond micro-powder composite thermal conductive material developed by TSMC has a thermal conductivity of 2000W/m·K, which increases the heat dissipation efficiency of 7nm chips by 40%. After adopting this technology, the Apple A18 processor has seen a 15% increase in continuous performance output and a 18% reduction in power consumption, providing a guarantee for high-performance computing in 5G mobile phones.

Device manufacturing: Precision machining with a 0.1% loss rate

5G high-frequency devices impose nanometer-level requirements on the processing accuracy of materials. In the manufacturing of silicon carbide (SiC) RF devices, diamond wire saw cutting technology has reduced the wafer loss rate from 3% to 0.1% and lowered the cost per piece by 60%. Data from SAN 'an Optoelectronics' silicon carbide production line shows that the surface roughness of wafers ground with diamond micro-powder reaches Ra0.05nm, meeting the manufacturing requirements of 5G millimeter-wave devices.

In the field of optical communication modules, the polishing technology of diamond micro-powder achieves a zero-defect light-transmitting surface for optical crystals. In the 400G optical module developed by Zhongji Xuchuang, the surface error of the diamond polished lens is controlled within ±5nm, reducing the optical signal transmission loss by 30% and helping the 5G fronthaul network achieve ultra-low latency.

Quantum communication: The accuracy of NV color center sensors leaps forward

The integration of 5G and quantum technology has given rise to new sensing demands. The NV color center sensor developed by the Guosheng Quantum team using nano-diamond micro-powder achieves a magnetic field measurement accuracy of 0.05%, which is 10 times higher than that of traditional equipment. This sensor has been applied to the position calibration system of 5G base stations, compressing positioning errors from the meter level to the centimeter level, and providing precise spatio-temporal services for scenarios such as autonomous driving and industrial Internet of Things.

From base stations to terminals, from device manufacturing to quantum sensing, diamond micro-powder is reconfiguring the 5G technology system with nanoscale precision. With the breakthrough in CVD diamond preparation technology, 2-inch diamond power semiconductor wafers have achieved mass production, with costs dropping by 60% compared to 2024. This technological revolution led by "industrial diamonds" not only solved the heat dissipation and processing problems in the development of 5G, but also laid the material foundation for ultra-high-speed communication in the 6G era.