辽宁Is diamond micro-powder suitable for processing super-hard materials?

In the field of high-end manufacturing, the precision and efficiency of processing super-hard materials directly determine the upper limit of product performance. From the wafer cutting of the third-generation semiconductor silicon carbide to the precise grinding of titanium alloys for aerospace, diamond micro-powder, with its unique physical and chemical properties, has become an "invisible champion" in the field of super-hard material processing.

Hardness and wear resistance: The natural Nemesis of super-hard materials

The microhardness of diamond micro-powder can reach up to 10,000 kg/mm², which is 1,000 times that of quartz and 150 times that of corundum. This hardness advantage enables it to achieve material removal at the micrometer or even nanometer level when processing materials such as cemented carbide, ceramics, and gemstones. For instance, in the cutting of silicon carbide wafers, the loss rate of diamond wire saws can be controlled below 0.1%, while that of traditional abrasives exceeds 5%. In the polishing of sapphire substrates, diamond micro-powder can reduce the surface roughness Ra value to 2-8nm, meeting the optical-grade light transmission requirements.

The detonation synthesis process of polycrystalline diamond micro-powder endows it with a unique microcrystalline structure, and its surface is composed of a large number of microcrystals smaller than 100 nanometers. This structure will form a "self-sharpening effect" during the processing - when the microcrystalline grains peel off due to wear, the newly exposed crystal planes will continuously provide cutting edges, keeping the processing efficiency stable. Data shows that the material removal rate of polycrystalline diamond in silicon carbide processing is 2 to 4 times that of single-crystal diamond, and it does not cause deep scratches, making it the preferred choice for processing hard and brittle materials.

Particle size classification: Precisely matching processing requirements

The particle size range of diamond micro-powder covers from 0-0.5 microns to 22-36 microns, and different particle sizes correspond to specific processing scenarios:

0-0.5 microns: Used for the final polishing of optical crystals and semiconductor wafers, it can achieve atomic-level surface flatness.

10-15 microns: Suitable for fine grinding of cemented carbide tools, balancing processing efficiency and surface quality;

22-36 microns: Used in the rough grinding stage to quickly remove the excess material.

Take the processing of third-generation semiconductors as an example. For the cutting of silicon carbide wafers, 12-22 micron diamond micro-powder is required to ensure the cutting speed, while for wafer grinding, the particle size needs to be switched to 6-12 microns to control the thickness of the surface damage layer. This precise particle size control capability enables diamond micro-powder to cover the entire process requirements from rough machining to ultra-precision polishing.

Technological iteration: From single abrasives to composite functional materials

As the processing accuracy requirements are raised to the nanometer level, the technical boundaries of diamond micro-powder are constantly expanding. Nano-diamond micro-powder (particle size <20 nanometers) is synthesized through detonation technology. While maintaining its super-hard properties, its surface is rich in functional groups such as hydroxyl and carboxyl groups, which can form chemical bonds with polymer materials. This characteristic makes it shine in the field of semiconductor packaging - when nano-diamonds are incorporated into epoxy resin, the thermal conductivity of the packaging material can be increased by 300%, while the coefficient of thermal expansion can be reduced to a level matching that of silicon chips, significantly enhancing the reliability of the device.

In the field of biomedicine, surface-functionalized nano-diamond micro-powders have demonstrated astonishing potential. Through amination modification, it can be used as a drug carrier to achieve targeted delivery. Coating the surface of orthopedic implants with a layer of nano-diamond can reduce the wear rate to one-tenth of that of traditional materials and extend the service life of artificial joints by more than 20 years.

Industry trend: High-end and customization go hand in hand

China's superhard materials industry has formed a complete ecological chain. The annual production capacity of industrial clusters in Henan, Hunan, Shandong and other places accounts for more than 60% of the global total. Data from 2025 shows that the market size of industrial diamond micro-powder is growing at an average annual rate of 4% to 5%, while the demand for high-end micro-powder in the semiconductor and aerospace industries is increasing by more than 8%. Enterprises are meeting the extreme demands of different scenarios through measures such as particle size classification refinement (for instance, dividing micro-powders under 4 microns into 17 grades) and customized surface treatment (such as electroless nickel plating and magnetron sputtering coatings).

From the laboratory to the production line, diamond micro-powder is reshaping the boundaries of super-hard material processing with its "hardcore" strength. With the breakthroughs in technologies such as CVD diamond films and nano-functional composite materials, this "industrial tooth" will unleash greater potential in the high-end manufacturing field.