Diamond micro-powder, through its high hardness, sharp cutting edge and uniform particle size distribution and other characteristics, can effectively improve the surface finish. Its mechanism of action and specific applications are as follows:
Improvement mechanism
1. High hardness and sharp cutting edges
The Mohs hardness of diamond micro-powder is 10. Its particles have distinct edges and sharp cutting edges, which can quickly scrape off surface defects and rough layers of materials, significantly reducing surface roughness.
2. Uniform particle size distribution
By controlling the particle size range of the micro-powder (such as 0-0.5 microns to 6-12 microns), the occurrence of deep scratches during the processing can be reduced, ensuring the consistency of the surface finish.
3. Self-sharpening property and efficient grinding
Diamond micro-powder can continuously expose new cutting edges during the grinding process, maintaining efficient grinding capacity and avoiding surface quality degradation caused by passivation.
Application example
1. Polishing of optical materials
In the processing of optical components, diamond micro-powder can effectively enhance surface smoothness and flatness, increase transmittance and reflectivity, and meet the requirements of high-precision optics.
2. Semiconductor wafer grinding and polishing
Diamond micro-powder, as the main abrasive of the grinding fluid, achieves high flatness and smoothness of the wafer surface in a short time through physical grinding action, meeting the strict requirements of semiconductor manufacturing.
3. Processing of gemstones such as crystals
By using the dry polishing method of diamond micro-powder, the facets can be ground more finely and smoothly quickly. The mirror-like effect of the polished facets is better, fully demonstrating the luster of jewels.
Key points of operation
1. Particle size selection
Polishing: Select micro-powder ranging from 0 to 0.5 microns to 6 to 12 microns to reduce scratches and enhance surface finish.
Grinding: Fine powder ranging from 5-10 microns to 12-22 microns is more suitable, taking into account both efficiency and surface quality.
2. Process optimization
In the multi-step grinding process, the surface roughness decreases step by step by gradually reducing the size of the diamond micro-powder.
Control the parameters such as the rotational speed and pressure of the grinding disc to ensure the uniform distribution of diamond micro-powder and give full play to its cutting effect.