SUPER HARD ABRASIVE
<p>Resin bond diamond provides high grinding performance and low grinding resistance, and is widely used in all wet and dry grinding fields to process superhard materials. In most cases, the resin bond system is phenolic resin or polyimide resin. In special cases, specialized resin bonds are also used. The addition of suitable additives gives the resin bond a wider applicability.</p>
Superabrasives
SUPER HARD ABRASIVE
Resin bond diamond provides high grinding performance and low grinding resistance, and is widely used in all wet and dry grinding fields to process superhard materials. In most cases, the resin bond system is phenolic resin or polyimide resin. In special cases, specialized resin bonds are also used. The addition of suitable additives gives the resin bond a wider applicability.
Tungsten carbide: cutting and milling tools, dies, etc.
Ceramics: silicon nitride, porcelain, alumina oxide, silicon carbide and glass.
Tungsten carbide: cutting and milling tools, dies, etc.
Ceramics: silicon nitride, porcelain, alumina oxide, silicon carbide and glass.
固原N30
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原N30
固原N56
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原N56
固原N60
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原N60
固原NP60
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原NP60
固原TN56
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原TN56
固原CU50
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原CU50
固原T
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原T
固原Cr
Famous standard coating:N30,N56,Cu50,Ti,Cr;
Can do different weight increment ratio per customers' requirement
固原Cr
固原SDG8-MS
固原SDG8-MS+
固原PDM2
White gray, blocky and semi-blocky, economic polycrystalline diamond micron powder,
Used in polishing and grinding of glass, ceramics and stones.
固原PDM2
固原PDM
White gray, blocky shape, polycrystalline structure,
Excellent performance in polishing and lapping glass and ceramics.
Available size:0-0.25~54-80
固原PDM
固原SDG6-MS
Economic monocrystal diamond micron powder, with good polishing
and high polishing
efficiency, used for processing stone, gems and other non-metallic materials.
Available size:0-0.25~54-80
固原SDG6-MS
固原MDG600
Good cubic-octahedral blocky monocrystal, extremely low impurity content,
High impacting toughness and thermal stability.
Ideal for core drilling and grooving of glass, ceramic, grinding of granite and tungsten carbide.
Available size:60/80-400/500
固原MDG600
固原MDG500
Highly shaped blocky cubic-octahedral grains, the toughness and thermal stability are between MDG400 and MDG600.
It achieves ideal balance of tool life and high cutting efficiency, suitable for edge grinding flat glass and bevel grinding.
Available size: 60/80-400/500
固原MDG500
固原MDG400
Blocky shape, sharp cutting edges, medium friability,
Recommended for metal bond diamond tools and electroplated tools.
Such as flat glass adge grinding, low demanding pencil edging beveling of glass and mirror.
Available size: 60/80-400/500
固原MDG400
固原MDG300
Angular shape, sharp cutting edge with high friability,
Recommended for metal bond diamond tools and electroplaed tools.
Available size: 60/80-400/500
固原MDG300
固原MDG200
Angular shape, sharp cutting edge with high friability.
Recommended for metal bond and electroplated bond tools for low impact, like grinding glass, ceramics, gemstones, cast iron.
Available size: 60/80-400/500
固原MDG200
固原DJM200
Rough surface, mostly used in grinding and polishing of sapphire substrates,
Optical windows, precision components, GaN wafer and ceramics.
固原DJM200
固原PDG-MS+
Economic polycrystalline resin diamond micron powder, with high precison polishing and better efficiency.
Available size :0-0.25~54-80
固原PDG-MS+