<p>PDFA-3 μm is suitable for copper-plate polishing of sapphire substrates under high-pressure single-side processing. It delivers stable performance, high polishing efficiency, excellent surface roughness, and a shallow surface damage layer after copper polishing.</p><p>PDRB-25 μm is designed for double-side fine lapping of sapphire window wafers. When used with a polyurethane polishing pad, it provides high removal rate, environmentally friendly processing, easy cleanup, reduced wafer breakage, a shallow surface damage layer, and high precision in surface profile and TTV.</p><p><br/></p>