<p><span style="font-size: 16px; font-family: arial, helvetica, sans-serif;">When used with a cast-iron lapping plate, SR-3 μm delivers a material removal rate of 1.3–1.5 μm/min and achieves post-lapping surface roughness of Ra ≤ 50 nm, offering 30–40% higher efficiency than comparable domestic products. The slurry residue does not agglomerate, is easy to clean, and produces scratch-free surfaces.</span></p><p><span style="font-size: 16px; font-family: arial, helvetica, sans-serif;">When used with a polyurethane polishing pad, PDRB-20 μm enables high removal rates, clean processing, easy cleanup, and reduced wafer breakage. It forms a shallower surface damage layer than cast-iron plate lapping, while maintaining comparable TTV, warp, and bow performance.</span></p><p><br/></p>