SUPER HARD ABRASIVE
<p>Resin bond diamond provides high grinding performance and low grinding resistance, and is widely used in all wet and dry grinding fields to process superhard materials. In most cases, the resin bond system is phenolic resin or polyimide resin. In special cases, specialized resin bonds are also used. The addition of suitable additives gives the resin bond a wider applicability.</p>
Superabrasives
SUPER HARD ABRASIVE
Resin bond diamond provides high grinding performance and low grinding resistance, and is widely used in all wet and dry grinding fields to process superhard materials. In most cases, the resin bond system is phenolic resin or polyimide resin. In special cases, specialized resin bonds are also used. The addition of suitable additives gives the resin bond a wider applicability.
Tungsten carbide: cutting and milling tools, dies, etc.
Ceramics: silicon nitride, porcelain, alumina oxide, silicon carbide and glass.
Tungsten carbide: cutting and milling tools, dies, etc.
Ceramics: silicon nitride, porcelain, alumina oxide, silicon carbide and glass.
樟树N30
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树N30
樟树N56
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树N56
樟树N60
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树N60
樟树NP60
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树NP60
樟树TN56
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树TN56
樟树CU50
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树CU50
樟树T
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树T
樟树Cr
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
樟树Cr
樟树SDG8-MS
樟树SDG8-MS+
樟树PDM2
White gray, blocky and semi-blocky, economic polycrystalline diamond micron powder,
Used in polishing and grinding of glass, ceramics and stones.
樟树PDM2
樟树PDM
White gray, blocky shape, polycrystalline structure,
Excellent performance in polishing and lapping glass and ceramics.
Available size：0-0.25~54-80
樟树PDM
樟树SDG6-MS
Economic monocrystal diamond micron powder, with good polishing
and high polishing
efficiency, used for processing stone, gems and other non-metallic materials.
Available size：0-0.25~54-80
樟树SDG6-MS
樟树MDG600
Good cubic-octahedral blocky monocrystal, extremely low impurity content,
High impacting toughness and thermal stability.
Ideal for core drilling and grooving of glass, ceramic, grinding of granite and tungsten carbide.
Available size:60/80-400/500
樟树MDG600
樟树MDG500
Highly shaped blocky cubic-octahedral grains, the toughness and thermal stability are between MDG400 and MDG600.
It achieves ideal balance of tool life and high cutting efficiency, suitable for edge grinding flat glass and bevel grinding.
Available size: 60/80-400/500
樟树MDG500
樟树MDG400
Blocky shape, sharp cutting edges, medium friability,
Recommended for metal bond diamond tools and electroplated tools.
Such as flat glass adge grinding, low demanding pencil edging beveling of glass and mirror.
Available size: 60/80-400/500
樟树MDG400
樟树MDG300
Angular shape, sharp cutting edge with high friability,
Recommended for metal bond diamond tools and electroplaed tools.
Available size: 60/80-400/500
樟树MDG300
樟树MDG200
Angular shape, sharp cutting edge with high friability.
Recommended for metal bond and electroplated bond tools for low impact, like grinding glass, ceramics, gemstones, cast iron.
Available size: 60/80-400/500
樟树MDG200
樟树DJM200
Rough surface, mostly used in grinding and polishing of sapphire substrates,
Optical windows, precision components, GaN wafer and ceramics.
樟树DJM200
樟树PDG-MS+
Economic polycrystalline resin diamond micron powder, with high precison polishing and better efficiency.
Available size :0-0.25~54-80
樟树PDG-MS+
