SUPER HARD ABRASIVE
<p>Resin bond diamond provides high grinding performance and low grinding resistance, and is widely used in all wet and dry grinding fields to process superhard materials. In most cases, the resin bond system is phenolic resin or polyimide resin. In special cases, specialized resin bonds are also used. The addition of suitable additives gives the resin bond a wider applicability.</p>
Superabrasives
SUPER HARD ABRASIVE
Resin bond diamond provides high grinding performance and low grinding resistance, and is widely used in all wet and dry grinding fields to process superhard materials. In most cases, the resin bond system is phenolic resin or polyimide resin. In special cases, specialized resin bonds are also used. The addition of suitable additives gives the resin bond a wider applicability.
Tungsten carbide: cutting and milling tools, dies, etc.
Ceramics: silicon nitride, porcelain, alumina oxide, silicon carbide and glass.
Tungsten carbide: cutting and milling tools, dies, etc.
Ceramics: silicon nitride, porcelain, alumina oxide, silicon carbide and glass.
玉树N30
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树N30
玉树N56
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树N56
玉树N60
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树N60
玉树NP60
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树NP60
玉树TN56
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树TN56
玉树CU50
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树CU50
玉树T
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树T
玉树Cr
Famous standard coating：N30,N56,Cu50,Ti,Cr；
Can do different weight increment ratio per customers' requirement
玉树Cr
玉树SDG8-MS
玉树SDG8-MS+
玉树PDM2
White gray, blocky and semi-blocky, economic polycrystalline diamond micron powder,
Used in polishing and grinding of glass, ceramics and stones.
玉树PDM2
玉树PDM
White gray, blocky shape, polycrystalline structure,
Excellent performance in polishing and lapping glass and ceramics.
Available size：0-0.25~54-80
玉树PDM
玉树SDG6-MS
Economic monocrystal diamond micron powder, with good polishing
and high polishing
efficiency, used for processing stone, gems and other non-metallic materials.
Available size：0-0.25~54-80
玉树SDG6-MS
玉树MDG600
Good cubic-octahedral blocky monocrystal, extremely low impurity content,
High impacting toughness and thermal stability.
Ideal for core drilling and grooving of glass, ceramic, grinding of granite and tungsten carbide.
Available size:60/80-400/500
玉树MDG600
玉树MDG500
Highly shaped blocky cubic-octahedral grains, the toughness and thermal stability are between MDG400 and MDG600.
It achieves ideal balance of tool life and high cutting efficiency, suitable for edge grinding flat glass and bevel grinding.
Available size: 60/80-400/500
玉树MDG500
玉树MDG400
Blocky shape, sharp cutting edges, medium friability,
Recommended for metal bond diamond tools and electroplated tools.
Such as flat glass adge grinding, low demanding pencil edging beveling of glass and mirror.
Available size: 60/80-400/500
玉树MDG400
玉树MDG300
Angular shape, sharp cutting edge with high friability,
Recommended for metal bond diamond tools and electroplaed tools.
Available size: 60/80-400/500
玉树MDG300
玉树MDG200
Angular shape, sharp cutting edge with high friability.
Recommended for metal bond and electroplated bond tools for low impact, like grinding glass, ceramics, gemstones, cast iron.
Available size: 60/80-400/500
玉树MDG200
玉树DJM200
Rough surface, mostly used in grinding and polishing of sapphire substrates,
Optical windows, precision components, GaN wafer and ceramics.
玉树DJM200
玉树PDG-MS+
Economic polycrystalline resin diamond micron powder, with high precison polishing and better efficiency.
Available size :0-0.25~54-80
玉树PDG-MS+
