电 话：+86-371-67770128
网 址：http://www.famous-cn.com
邮 箱：sales@famous-cn.com；service@famous-cn.com
销售地址：郑州市郑东新区CBD商务外环路14号路劲大厦2313室
公司地址：河南孟州前姚工业区
电 话：+86-391-8551158
Product Overview
CVD diamond heat sink exhibits the highest known thermal conductivity among all solid materials at room temperature, outperforming other commercially available thermal management materials.
— Highest thermal conductivity among all materials
— Excellent electrical insulation
— Three thermal conductivity grades available
— Customizable length, width, and thickness
— Surface metallization available, including titanium, nickel, platinum, gold, and gold-tin, enabling low-temperature solderability of diamond materials.
Product Specifications
| Diamond Heat Spreader | Thermal Conductivity at 300 K (W/m·K) | 1000-1200 | 1200-1600 | 1600-2000 | ||
| Parameter | Specification | Coefficient of Thermal Expansion at 300 K(ppm/K) | 1.0±0.1 | 1.0±0.1 | 1.0±0.1 | |
| Diameter /mm | ≤Φ102 | Electrical Resistivity after Metallization（Ωcm） | >2*10⁷ | >2*10⁷ | >2*10⁷ | |
| Thickness /mm | ≥0.4mm（尺寸≤25mm） ≥0.55mm(尺寸≤80mm) | Metal Coating Adhesion Strength （Kg/mm²） | 30 | 30 | 30 | |
| Thickness Tolerance /um | ±20 | Vickers Hardness （kg/mm²） | 8000 | 8000 | 8000 | |
| Perpendicularity of Cross Section | 90°-2.0° | Fracture Toughness（MPa m⁰·⁵） | 5.3-7 | 5.3-7 | 5.3-7 | |
| Top Surface Roughness /nm | Ra≤30 | Specific Heat Capacity （J/Kg K） | 520 | 520 | 520 | |
| Bottom Surface Roughness /nm | Ra≤30 | Young's Modulus （GPa） | 1100 | 1100 | 1100 | |
| Thermal Conductivity /W·m.K | 1000-2000 | Density （g/cm³） | 3.52 | 3.52 | 3.52 | |
CVD Diamond Heat Sink Application
