电 话：+86-371-67770128
网 址：http://www.famous-cn.com
邮 箱：sales@famous-cn.com；service@famous-cn.com
销售地址：郑州市郑东新区CBD商务外环路14号路劲大厦2313室
公司地址：河南孟州前姚工业区
电 话：+86-391-8551158
Product Overview
Cu-diamond composite is a new high-performance metal matrix composite material produced through advanced composite fabrication technology, with diamond as the reinforcement phase and copper as the matrix. It offers a thermal conductivity of 600–800 W/m·K.
The product combines diamond’s ultra-high thermal conductivity with copper’s excellent machinability. Its CTE can be tailored to match semiconductor chips, improving thermal performance and reliability. With lower density, lighter weight, high flexural strength, and excellent hermeticity, it is ideal for high-heat-flux applications such as AI chips and power modules.
Product Specifications
| Standard Product Specifications | ||||
| Length(mm) | Width (mm) | Thickness (mm) | Thermal Conductivity(W/m·K) | |
| 1 | 10 | 10 | 1/1.5 | 600，700，800 |
| 2 | 15 | 10 | 1/1.5 | 600，700，800 |
| 3 | 30 | 20 | 1/1.5 | 600，700，800 |
Notes: 1.Custom dimensions are available upon request. 2.Metallized products can be provided upon request. | ||||
Cu-diamond Application
Suitable for thermal management in semiconductor laser chips, satellite and mobile communications, navigation, electronic warfare, radar systems, microwave devices, power amplifiers, and high-power semiconductor lighting.
