Thermally conductive fillers are additives used to enhance the overall thermal conductivity of matrix materials, improving heat dissipation and thermal management performance. Typically supplied as solid powders, these fillers may include metals, non-metals, high-thermal-conductivity ceramics, and carbon-based materials. Common options include alumina (Al₂O₃), boron nitride (BN), carbon fiber, graphite, and diamond. With its exceptional thermal conductivity, diamond powder is widely used in high-end thermal management materials, especially in applications requiring efficient heat transfer and low thermal expansion.

The product offers high thermal conductivity, significantly improving the thermal conductivity of matrix materials to ensure rapid heat transfer. It also features excellent dispersibility to prevent agglomeration, strong compatibility with matrix materials for stable distribution during processing, as well as high-temperature resistance and chemical stability.

Widely used in thermal grease, thermal silicone pads, thermal gels, and other thermal interface materials.

1) Thermal Grease: Used as thermally conductive filler for LED lighting, thermal gap filling in air-source heat pump water heaters, and thermal coating applications for MOS, CPU, and GPU components in consumer electronics.

2) Thermal Silicone Pads: Used for heat dissipation in planar transformers, thermal gap filler at the bottom of power supplies, and heat dissipation  filler for power modules.

3) Thermal Gel: Used for thermal management of automotive electronic power devices, smartphones and consumer electronics modules, as well as high-power heat sources in wireless communication equipment such as AAU and BBU.